Q²M Compound+ Redefined is a heavy cutting paste that delivers outstanding scratch and defect removal. It achieves high abrasion with very little dust and minimal secondary defects. Light holograms may appear, but they’re quickly cleared with a single pass of Q²M Polish.
Q²M Compound+ Redefined
$14.99
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HIGH CUTTING POWER
Q²M Compound+ Redefined delivers enhanced cutting performance without creating excessive defects. Its formula uses premium Japanese abrasives for fast, effortless removal of severe imperfections. With no silicone or fillers, surface preparation and polish wipe-off are quicker and easier.
REDEFINED
Introducing our REDEFINED line. At GYEON, we've elevated our already acclaimed chemical formulas to new heights. Through meticulous reworking and refining, we've achieved unparalleled performance, exceptional durability, and effortless usability. Our dedication remains unwavering—to provide our customers with nothing short of the finest user experience.
PRO TIP
Q²M Compoud+ REDEFINED is unlike any other cutting polish. With its water base, speed and temperature should be reduced for the best results. Work in small sections, moving the machine slowly across the surface.
TIP: Compared to its previous version, Q²M Compound+ REDEFINED retains a high level of cutting, driving a longer working cycle without drying out. It is ideal for high-temperature and humid climates.
CONSUMPTION: 15-40ML/PANEL
PRO TIP
Q²M Compound+ is unlike any other cutting polish. With its water base, both speed and temperature shall be reduced to get the best results. Work in small sections, moving the machine slowly across the surface.
TIP: Q²M Compound+ has its highest cutting abilities during the first period of the workcycle. Each attempt should take no longer than 45 seconds.
CONSUMPTION: 15-40ML/PANEL
